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TDB SMT DIP switches target high-density PCB layouts
The half-pitch (1.27 mm) design is for reducing PCB footprints while supporting automated SMT assembly.
In terms of electrical performance, the gold-plated, washable DIP switches offer up to 50V DC, 100 mA steady-state contact ratings, a maximum contact resistance of 100 mΩ, and a 1,000-cycle mechanical and electrical life.
The TDP series is available in 2, 4, 6, 8, and 10-position options, to match required configuration density for applications. These may be in industrial control equipment, power supplies and inverter systems, security and fire alarm systems and IoT devices, says the compnay.
“When space is critical, and reliability is non-negotiable, the TDB Series delivers exactly what design engineers need,” said Jesus Santos, Global Product Manager at Littelfuse.
“Its ultra-miniature footprint, gold-plated contacts, and washable sealing enable confident designs even in dense, demanding applications.”
Littelfuse TDB series
| Model | Positions | Len (mm) | Design Advantage |
|---|---|---|---|
| TDB02 | 2 | 3.67 | Minimal footprint for tight layouts |
| TDB04 | 4 | 6.21 | Compact multi-setting configuration |
| TDB06 | 6 | 8.75 | Balanced density and usability |
| TDB08 | 8 | 11.29 | Higher configuration flexibility |
| TDB10 | 10 | 13.83 | Maximum settings in minimal space |
You can read more about the TDB series online on the Littelfuse website.
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