Sensors
System-Level Test for Next-Gen AI and HPC Devices
Multi-zone thermal control is becoming increasingly important. Rather than treating the package as a single thermal enti...
Passive 3D Thermal “Cloak” Hides Objects from Heat, from Any Direction
Note that this isn’t just a thermal barrier preventing heat from reaching or leaving a target. Instead, it directs the f...
APU Adds NPU to Target Robotics
I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage ...
Simple Power Sequencing for Multi-Rail Processors
From graphics processor units (GPUs) and central processing units (CPUs) to field-programmable gate arrays (FPGAs), digi...
2027 Data Center Frontier Trends Summit and Microgrid Knowledge in Arizona
Data Center Frontier announced today that the fourth annual Data Center Frontier Trends Summit will take place May 5–7, ...
NASA and Electra Aero Unveil Turbo-Electric Aircraft Concept for Practical Next-Generation Airliners
Electra Aero recently unveiled a new conceptual aircraft design for ...
MRDIMMs: Memory for AI Data Centers
MRDIMMs provide higher capacity and performance to meet the demands of AI data centers.
Design Scalable Switching Architectures for High-Channel-Count Semiconductor Test Systems
Key Design Challenges in High-Channel-Count Switching SystemsSelecting the appropriate switching to...
