Tesla Tapes Out AI5 Chip in Partnership With TSMC and Samsung

Elon Musk announced today on X that Tesla has completed the design of a new generation of its AI chips for Full Self-Driving (FSD). The CEO also mentioned earlier that the AI5 chip will offer performance comparable to NVIDIA’s “Hopper” architecture, with two AI5 units matching the power of a single “Blackwell” processor. In late 2025, reports indicated that Samsung had achieved a significant win for its previously struggling foundry business, as Tesla decided to split the manufacturing of its new AI5 accelerator between Samsung and TSMC. The chips will be produced at Samsung’s plant in Taylor, Texas, and TSMC’s facility in Arizona. This decision is part of a strategy to keep the supply chain diversified and maintain chip supply under control for any demand scenario.

Samsung and TSMC are not the only partners in this project. Tesla is also sourcing DRAM chips from SK hynix, which appear to be LPDDR5X memory integrated into the package. On both the left and right sides, there are two rows of SK hynix LPDDR5X memory modules, each with three modules. This totals 12 LPDDR5X memory modules per AI5 chip. With 16 GB per module, this results in 192 GB of LPDDR5X memory per single AI5 SoC.

Additionally, Tesla has ambitious plans for nine-month design cycles for the AI6, which will also be part of the joint effort between Samsung, TSMC, and possibly even Intel with its advanced packaging. Musk confirmed that the AI6 and Dojo 3 projects, among other “exciting chips,” are currently in progress, suggesting that we could see much more custom silicon ASICs in the coming months.