Intel “Razor Lake-AX” Could Bring Back On-Package Memory

Intel plans to reintroduce on-package memory in the future, with the “Razor Lake-AX” potentially being the product to carry this feature. This could be a successor to the “Nova Lake” generation, expected to arrive in late 2026. The last time Intel used on-package memory was with the “Lunar Lake” Core Ultra 200V series of CPUs, which included LPDDR5X-8533 memory in a single package alongside the CPU, GPU, and I/O die. Intel had previously stated that future CPU generations after “Lunar Lake” would use off-die memory, as sourcing and integrating additional memory modules in its SoCs is challenging, despite having technologies like EMIB and Foveros 3D to support integration. However, this decision seems to be reconsidered, as Intel is reportedly planning to integrate memory back on-package with “Razor Lake-AX.”

Intel’s AX variants of SoCs have long been rumored to offer significant integrated graphics capabilities to handle demanding graphics workloads. This lineup is intended to compete directly with AMD’s “Halo” series, which includes “Strix Halo,” “Gorgon Halo,” and other future revisions like “Medusa Halo.” Intel aims to achieve excellent iGPU performance, bundled with substantial integrated memory such as LPDDR5X or the upcoming LPDDR6 memory. Eventually, Intel might reintroduce HBM memory, similar to what it did with “Kaby Lake G,” but we are still awaiting more details from rumors and leaks. Amidst a significant memory shortage in the PC gaming world, Intel would likely face challenges in acquiring sufficient DRAM stock. However, by the time “Razor Lake-AX” arrives in the coming years, the situation could be quite different.