Tag Archives: packaging
Photon Bridge hooks up with PHIX for photonics packaging
The collaboration reflects a shared commitment to developing a sustained wo...
NIST develops high temperature photonics packaging
IollNIST (The US National Institute of Science and Technology) scientists h...
TI “Transforms” Isolated Power Modules with Multichip Packaging
Isolated Bias-Supply Modules Spanning from EVs to AISoundarapandian said IsoShield could make a difference in EVs, which...
What caught your eye? (AI optical interconnects, ASML packaging, ConnectedCosmos)
The Electronics Weekly team share some fingerposts – their picks of the wee...
Apple MacBook Neo Capped at 8 GB RAM by A18 Pro InFO-PoP Packaging
Yesterday, Apple announced its newest low-cost MacBook Neo, starting at $599 in the United States, or about $499 for edu...
Apple M5 Pro and M5 Max Debut New “M-Core” Tier and SoIC 2.5D Packaging
Apple today launched its most advanced silicon design yet with the introduction of the M5 Pro and M5 Max processors for ...
Imec PDKs for packaging sub-2nm chiplets
These early-access PDKs bring advanced packaging capabilities within reach ...
ASML looking at expanding into packaging
“”We look at what are potential directions the industry could take, and wha...