Tag Archives: packaging
eBook: Packaging: The First Line of Defense for Space Electronics
Space exposes electronics to a relentless radiation environment. Radiation-hardened chips are designed to deal with ever...
Tessalia plans $250m packaging plant in France
Patrice Caine, Chairman and CEO of Thales, said Tessalia represents a push ...
AMD “Zen 7” IP to Use TSMC A14 Node and More Advanced Packaging
AMD is gradually preparing to launch its next-generation "Zen 6" series of processors under the new EPYC "Venice" server...
Photon Bridge hooks up with PHIX for photonics packaging
The collaboration reflects a shared commitment to developing a sustained wo...
NIST develops high temperature photonics packaging
IollNIST (The US National Institute of Science and Technology) scientists h...
TI “Transforms” Isolated Power Modules with Multichip Packaging
Isolated Bias-Supply Modules Spanning from EVs to AISoundarapandian said IsoShield could make a difference in EVs, which...
What caught your eye? (AI optical interconnects, ASML packaging, ConnectedCosmos)
The Electronics Weekly team share some fingerposts – their picks of the wee...
Apple MacBook Neo Capped at 8 GB RAM by A18 Pro InFO-PoP Packaging
Yesterday, Apple announced its newest low-cost MacBook Neo, starting at $599 in the United States, or about $499 for edu...
Apple M5 Pro and M5 Max Debut New “M-Core” Tier and SoIC 2.5D Packaging
Apple today launched its most advanced silicon design yet with the introduction of the M5 Pro and M5 Max processors for ...