Ensilica lands its largest satellite payload contracts

The client company is not named but the contracts involve developing two chips for its next-generation satellite network. And their value is potentially worth in excess of $50 million from 2030.

The deals span both satellite payload and user terminal silicon, says Ensilica, and include a combination of Asic (Application Specific Integrated Circuit) and Application Specific Standard Part (ASSP) systems.

“The award provides significant industry validation for EnSilica and we are very proud of our technology being selected for this major Space programme following extensive joint study phases,” said Ian Lankshear, CEO of EnSilica, pcictured. “In addition, the scale and structure of the project means that it will generate attractive short term NRE revenues with the potential for substantial long-term supply revenues.”

“Furthermore, the ASSP elements of the programme demonstrate the strength of our platform strategy, utilising EnSilica’s reusable silicon solutions that can be deployed across multiple customers and programmes.”

Contract details that have been released include initial NRE (non-recurring engineering) revenues of $6.8 million starting this financial year. The agreement is also expected to unlock up to $3 million of additional matched funding from the UK Space Agency.

The programme is due to progress through phased development over the next two and a half years.

You can read the official financial statement in the Ensilica announcement.

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