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Cooler Master and G.SKILL Partner to Bring Active Cooling Technology to DDR5 Memory
Designed for next-generation AI computing, gaming, content creation, and professional applications, this new memory supports ultra-high capacities up to 64GBx2 while maintaining long-duration stability under intensive workloads. Cooler Master’s active thermal design helps ensure sustained memory performance, signal integrity, and reliable operation during continuous high-load usage.
Extreme Speed, Sustained by Dedicated Active Cooling
Featuring support for AMD EXPO memory overclock profiles up to DDR5-6000 CL26 and extreme-frequency DDR5 CU-DIMM up to DDR5-8400 with Intel XMP 3.0, the co-engineered solution combines G.SKILL’s elite overclocking memory technology with Cooler Master’s dedicated active thermal architecture to sustain peak DDR5 performance beyond conventional thermal limits.
Acoustic-Optimized High Performance
Extreme memory performance should not compromise overall system acoustics. The integrated cooling architecture is engineered to deliver efficient heat dissipation with a controlled noise profile, enabling high-frequency DDR5 operation while preserving a quieter and more refined PC experience.
The partnership reflects Cooler Master’s Computex 2026 theme, Thermal Authority, Every AI Reality, by addressing a clear mission in system design: to provide stability and sustainability under high workloads with low noise. Memory performance is becoming a more important part of overall system stability, and cooling must be considered from a full system perspective.
Key Product Features
- Next-Gen DDR5 Memory Platform: Super low latency up to 6000 MT/s CL26 (AMD EXPO), extreme-frequency CU-DIMM up to 8400 MT/s (Intel XMP 3.0)
- Advanced Active Cooling Technology: MasterDimm AC active cooling provides up to -15°C thermal improvement
- Quiet Thermal Design: A noise-optimized blower fan and specially designed air flow heat sink allow for greater cooling under 35dB volume
