Electronics
Apple M5 Pro and M5 Max Debut New “M-Core” Tier and SoIC 2.5D Packaging
Apple today launched its most advanced silicon design yet with the introduction of the M5 Pro and M5 Max processors for ...
Imec PDKs for packaging sub-2nm chiplets
These early-access PDKs bring advanced packaging capabilities within reach ...
Micron Releases World’s First High-Capacity 256 GB LPDRAM SOCAMM2 for Data Center Infrastructure
Micron Technology, Inc. (Nasdaq: MU) today extended its leadership in low-power server memory by shipping customer sampl...
MWC: Skyworks and Mediatek reference design for front-end PA for 6G
The design of the SKYR60002 advanced 6G FR3 LNA and power amplifier module ...
BenQ Launches New 5K Glossy Monitor Purpose-Built for Mac Users
BenQ, the global leader in display and color-tuning innovation, today announced its MA270S, a new 27-inch 5K monitor des...
Wi-Fi HaLow module increase 2.4GHz range x10
The module is based on the Morse Micro MM8108 chipset and operates in the ...
NVIDIA GeForce v595.71 Drivers Reportedly Restricts Voltage on RTX 50 Series GPUs
NVIDIA released its GeForce 595.71 WHQL Game Ready Drivers yesterday to address issues with the previous 595.59 WHQL ver...
ASML looking at expanding into packaging
“”We look at what are potential directions the industry could take, and wha...
Huawei Debuts Its Latest Atlas 950 and TaiShan 950 SuperPoDs at MWC 2026
At MWC Barcelona 2026, Huawei debuts its latest SuperPoD product Atlas 950 SuperPoD, TaiShan 950 SuperPoD and a series o...
MWC: Telecom companies and Nvidia pursue AI-RAN in 6G
6G wireless networks will become the fabric for enabling autonomous machine...