AMD X970E Chipset Based on Same Promontory 21 Silicon as X870E and X670E, Native Support for CUDIMM

AMD’s next-generation 900-series chipset to launch alongside Ryzen desktop processors powered by the “Zen 6” microarchitecture, could be fundamentally the same chipset as the current 800-series, based on the same “Promontory 21” silicon designed by ASMedia. What differentiates the platform from current 800-series and previous 600-series chipset could be a series of add-on features, new BIOS-level software features AMD is introducing with its next-gen processors, and a significantly overhauled memory support.

With its next-gen Ryzen “Olympic Ridge” desktop processors, AMD is introducing a new client I/O die, probably built on the 4 nm foundry node. This new cIOD is expected to feature a new set of DDR5 memory controllers that support higher DRAM clock speeds, tighter timings, and come with native support for CUDIMMs and CAMMs. The motherboard-side readiness for CUDIMMs and DDR5 CAMMs could be exclusive to AMD 900-series chipset models. AMD is readying the new EXPO 1.2 standard for overclocking DDR5 memory modules. With these upgraded memory controllers and native support for CUDIMMs backed by EXPO 1.2, AMD can catch up with Intel in terms of DDR5 memory speeds.