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Intel “Razor Lake-AX” to Feature up to 32 Xe3 GPU Cores

Earlier this week, we learned that Intel also plans to return to on-package memory with the upcoming “AX” chip. Although the company initially claimed that the Core Ultra 200V “Lunar Lake” was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory to “Razor Lake-AX.” Additionally, it’s unclear where Intel will manufacture this massive chip, but the large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to what Intel’s Xeon CPUs typically use. Do note that the image below is not a real Intel slide.
Previously, Intel was considering creating a “Nova Lake-AX” SoC featuring 48 Xe3 cores paired with a 28-core CPU cluster. However, this has been put on hold, and the “AX” generation will not debut with the upcoming “Nova Lake” generation. Intel plans to launch the first batch of chips with the “AX” suffix after “Nova Lake,” with “Razor Lake-AX” expected to arrive in 2027.











