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Apple Eyes Intel and Samsung Foundries for Chip Production in the U.S.

Additionally, Apple is reportedly waiting for Intel to release the 18A-P PDK version 1.0, which is on track to launch in the first half of 2026 or may have already been released to partners. Once available, Apple plans to start with the lowest-end M-series chip, used in MacBook Air and iPad Pro devices, as previously mentioned. This node is particularly interesting due to its performance characteristics, as the 18A-P can deliver a 9% performance increase at the same power level or achieve 18% power savings at the same performance level compared to the standard 18A. This is exactly what Apple is looking for. Coupled with better thermal conductivity, these designs should offer improved heat dissipation and performance compared to what Apple currently achieves with TSMC’s 3 nm process in the M5 SoC.
Finally, the Bloomberg report highlights Samsung Foundry as a viable alternative to TSMC with its SF2 2 nm designs. While Samsung is not particularly known for advanced packaging like Intel, Apple could potentially use their dies and package them with their partner Amkor. For designs sourced from Intel, the company might utilize technologies like EMIB and Foveros 3D packaging to achieve new design goals. This could lead to a more diversified supply chain and, importantly, greater geopolitical resilience by manufacturing a large part of its product portfolio in the United States.











