Technomelt PA 6370 – Henkel releases ultra-low viscosity product

The polyamide-based hot melt – an alternative to conventional potting encapsulants – will fill gaps as small as 0.5mm. It is an adhesive for many substrates, including FR4, and many plastics including ABS and PC.

Technomelt PA 6370

Technomelt PA 6370 is described by the company as “a highly flowable, ultra-low melt viscosity formulation engineered for the most intricate and challenging electronic systems and components”.

“Achieving void-free small gap filling while maintaining material adhesion strength after exposure to water, salt fog, humidity, and temperature ageing is a formidable task,” says Henkel Senior Business Development Manager, Justin Kolbe.

“That’s why Technomelt PA 6370 is such an important achievement for electronics protection requirements. It delivers extreme manufacturing flexibility, high throughput, UL flame retardancy compliance, and high environmental resistance for assemblies with small gaps exposed to continuous use in harsh outdoor conditions.”

Features

• Low-viscosity, small gap filling (0.5 mm/0.0217″)
• Easy mouldability
• Strong adhesion to FR4, ABS, PC and other electronic plastics
• Excellent self-extinguishing properties
• Excellent hydrophobicity
• UL 94 V-0 rated

More information, and sample requests, is on the Henkel website.

The company’s headquarters are in Düsseldorf.

See all our electronics products.