Molex buys Teramount | Electronics Weekly

Teramount’s detachable, passive-alignment fibre-to-chip connectivity products for CPO enable faster data transfer rates for AI, cloud computing and 5G workload

The engineering expertise in Co-Packaged Optics R&D encompasses Teramount’s Israel-based design centre

Koch Disruptive Technologies was the lead  investor  in Teramount’s $50 million Series A financing in 2025

Teramount’s TeraVERSE platform, based on its universal photonic coupler and wafer-level self-aligning optics, provides a pragmatic, field-serviceable interface between optical fibre and silicon photonics chips and was recently announced as part of the Molex one-stop CPO solution at OFC 2026.

“Teramount’s TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fiber-to-chip interface we are afforded a foundational element to realize mainstream CPO adoption,” said Aldo Lopez, president, Datacom Solutions, Molex.