Electronics
Farnell signs Hongfa | Electronics Weekly
Farnell has signed a new distribution agreement with Hongfa, a leading manuf...
Corsair Launches Low-Profile VANGUARD AIR 99 WIRELESS Gaming Keyboard
Corsair, a leading maker of performance gaming peripherals, announced the release of the 99% form factor, low-profile VA...
Teledyne e2v Begins Production of its 16GB DDR4-X1 Flight Models for Space Applications
Teledyne e2v is pleased to announce the start of full production of its 16 GB DDR4-X1 Flight Model (FM), expanding its p...
Micron in volume production of HBM4 for Vera Rubin
Micron is also sampling HBM4 48GB 16H which stacks 16 HBM die.
“The next er...
Silicon Motion Showcases Enterprise SSD Controllers and PCIe NVMe Boot Drive Solutions at GTC 2026
Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state...
SK hynix Showcases AI Memory Leadership at NVIDIA GTC 2026
SK hynix Inc. announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NV...
Jeff Kaplan Says The Legend of California Isn’t For Everyone: “Just Play the Game that Makes You Happy”
Jeff Kaplan, formerly a Blizzard executive, recently announced both a new studio and a new game, The Legend of Californi...
Micron Announces Mass-Production of HBM4, SOCAMM2 Memory Modules and PCIe Gen 6 SSDs
At NVIDIA GTC 2026, Micron announced it is in high-volume production of three products at once, all timed around and des...
ASUS Unveils Liquid-Cooled AI Infrastructure Powered by NVIDIA Vera Rubin Platform
ASUS today unveiled its fully liquid-cooled AI infrastructure at NVIDIA GTC 2026 (Booth# 421), delivering a comprehensiv...