Rapidus signs MoU with UKSC

In  January 2026, the leaders of Japan and the UK agreed to strengthen cooperation in the technology sector. 

Building on this, Japan Prime Minister Sanae Takaichi (pictured) visited the UK on June 14 and met UK Prime Minister Keir Starmer to advance Japan-UK technology cooperation. 

“The UK Government’s AI Hardware Plan recognised the importance of building trusted international manufacturing and technology partnerships that can help UK companies access the capabilities they need to innovate and grow, this agreement is an important step in delivering that ambition “ says UKSC CEO Andy McLean.

Rapidus is currently conducting pilot production with the aim of mass-producing 2nm logic semiconductors in Japan in 2027. 

With the signing of this agreement, Rapidus will begin information sharing and discussions with a view to strengthening collaborations in the future.

“Since our foundation, we prioritized global collaboration and building key alliances with countries to further their semiconductor programs. Our work with the UKSC is another important step to fulfilling our mission,” said Dr. Atsuyoshi Koike, representative director and CEO, Rapidus Corporation. “We are honored that the UK has put their trust in Japan and Rapidus and we look forward to working with them to establish their next era of semiconductor development.”