Maxsun Shows Off iCraft Z890 ITX Wi-Fi Motherboard at Computex 2026

Maxsun has officially shown off its new iCraft Z890 ITX motherboard at Computex, with active chipset and VRM cooling in an ITX form factor. The Z890 ITX is built for the Intel LGA-1851 socket, with support for Intel’s Core Ultra 2 series CPUs in mind. Maxsun claims that the Z890 ITX is capable of powering a CPU with a 250 W TDP, thanks to an 8+1+1 power circuit design, making it powerful enough even for the likes of the Core Ultra 9 285K at stock clocks, according to the testing in the TechPowerUp Core Ultra 9 285K in-depth technical review. Pricing and a launch date have not yet been revealed for the Maxsun iCraft Z890 ITX Wi-Fi motherboard.

Physically, the new motherboard sports a full-length PCIe 5.0 ×16 slot and two DDR5 memory slots for dual-channel memory configurations, and it has active cooling on both the VRM and in the M.2 heat sink under the PCIe slot. It supports 1× PCIe 5.0 ×4 M.2 SSD on the front of the motherboard, 1× PCIe 4.0 ×4 M.2 SSD in a rear-mounted M.2 slot, and 4× PCIe 4.0 Slim SAS SFF-8654 4i SSDs. As for network connectivity, the motherboard sports Bluetooth 5.4 and Wi-Fi 7, as well as Realtek 5G LAN, and the rear I/O has both DisplayPort 1.4 and HDMI 2.1, 3× USB Type-C 20 Gbps ports, 6× USB Type-A 10 Gbps ports, 2× USB 5 Gbps ports, and 4× USB 2.0 ports. The motherboard also features a built-in 5 v ARGB connector for case and fan customization purposes.