Enplas is Reimaginging Water Block Microfin Lattices at Computex 2026

With Moore’s Law off the rails and as the computing industry becomes more dependent on liquid cooling, and pressure to make cooling as water-efficient as possible, a need has arisen to make liquid cooling more efficient, so heat from today’s high-TDP components such as AI GPUs and high core-count server CPUs can be better dissipated to coolant. Enplas is a company that specializes in injection molding manufacturing, and has invented new ways to create pure-copper cold plates for water blocks with new forms of microfin lattices (where the coolant interacts with the heat source inside the block).

Enplas’s original design calls for a topology-optimized design. The copper structure in the glass plate below (next to the ruler) is a scale-out exaggeration of what the fin-lattice looks like. Coolant is made to flow through channels of interweaving copper that make up significantly higher surface area for heat dissipation than a traditional extruded copper microfin lattice created by slicing a block of copper would.