Shuttle Presents the XPC Barebone XB860G2

Compact design meets workstation performance: With the new XB860G2, Shuttle is expanding its portfolio with a high-performance solution that bridges the gap between ultra-compact mini-PCs and bulky tower systems. Thanks to the Intel B860 chipset, support for ‘Arrow Lake-S’ and a PCIe 5.0 slot for dual-slot graphics cards, the system offers maximum flexibility for demanding professional applications.

Hardware requirements in professional environments are diverse: whilst ultra-compact 1-liter systems are the ideal choice for efficient office applications and space-critical installations, computationally intensive projects often require additional hardware resources. The new Shuttle XPC Barebone XB860G2 fills precisely this market niche. With a chassis volume of around 4.7 liters, it offers space for dedicated components and optimized cooling performance that was previously reserved for significantly larger systems, without sacrificing the advantages of a compact form factor.

A success story in its third generation
The XB860G2 is not a one-off, but the logical evolution of a successful product line. As the third model in the distinctive G2 format, it follows on from its tried-and-tested predecessors, the XH510G2 and XH610G2. With each generational change, Shuttle has adapted the platform to the latest industry standards. Whilst the series launched in 2022 with the Socket 1200, the XB860G2, featuring the new Socket 1851, now represents the technological pinnacle of this development and offers partners a long-term, predictable platform strategy.

Forward-looking architecture: LGA1851 and DDR5

At the heart of the XB860G2 is the latest Intel B860 chipset based on the LGA1851 socket. This makes the system fully compatible with the latest Intel Core Ultra processors of the 200 series (“Arrow Lake-S”). System integrators benefit from the high energy efficiency of up to 24 cores and the integrated NPU for AI acceleration. With two SO-DIMM slots, the barebone supports up to 96 GB of DDR5 memory (5600 MT/s) in dual-channel mode.

Maximum graphics power in the smallest of spaces

The most striking feature of the XB860G2 is its expandability in terms of graphics. Via a pre-installed 90° riser card, the system offers a PCI Express x16 Gen 5 slot. This allows the integration of powerful dual-slot graphics cards with a length of up to 208 mm. This transforms the compact system into either a CAD workstation or a powerful edge server for real-time AI video analysis.

For additional flexibility, a further PCIe 4.0 x1 slot is available, provided a single-slot graphics card or the integrated graphics unit is used.

Superior storage options and connectivity

When it comes to mass storage, the XB860G2 relies on state-of-the-art NVMe technology and offers an impressive array of options for this size class:

• Three M.2-2280 slots: A primary slot with an extremely fast PCIe 5.0 x4 connection, plus two further slots with PCIe 4.0 x4, ensure maximum data throughput.
• Multi-display: Up to four independent displays are supported as standard (1x HDMI 2.1, 1x HDMI 2.0, 1x DisplayPort 1.4a), which facilitates use in complex work environments.

Network connectivity is provided via professional dual LAN (1x 2.5 Gbps and 1x 1 Gbps), which is essential particularly in security-critical environments or when separating networks (e.g. management and data networks).

Target groups and application scenarios

Thanks to its robust construction and high performance density, the XB860G2 is ideally suited for:

• Medical image processing: High graphics performance combined with a compact footprint in diagnostics.
• Edge computing & AI: Local data processing through the combination of NPU support from the CPU and the computing power of a dedicated GPU.
• Modern digital signage: Implementation of complex video walls or high-resolution presentation systems with up to 8K resolution.

Availability
The Shuttle XPC Barebone XB860G2 is available now through authorized distribution channels. The package includes a suitable VESA mount for vertical or horizontal installation, as well as a powerful, external 180-watt power supply.

Technical highlights at a glance:

• Model series: 3rd generation of the G2 series (successor to XH510G2/XH610G2)
• Chipset: Intel B860 (LGA1851 socket for Arrow Lake-S up to 65 W TDP)
• RAM: Max. 96 GB DDR5-5600 (2x SO-DIMM)
• Graphics: PCIe 5.0 x16 slot for dual-slot cards up to 208 mm
• Storage: 3x M.2 NVMe SSD slots (1x Gen 5, 2x Gen 4)
• Network: Dual LAN (2.5 GbE + 1 GbE)
• Dimensions: (W x D x H) 237 x 200 x 95 mm (approx. 4.7 liters)